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室温固化低黏度双酚F环氧树脂体系的研究
Study on room temperature cured and low viscosity diglycidyl ether of bisphenol F resin system

室温固化低黏度双酚F环氧树脂体系的研究

ISSN:1002-7432
2007年第22卷第1期
研究论文
刁岩,洪晓斌,陈一民 DIAO Yan,HONG Xiao-bin,CHEN Yi-min
国防科学技术大学航天与材料工程学院,湖南,长沙,410073 College of Aerospace and Material Engineering, National University of Defense Technology, Changsha 410073, China

选择具有设计结构的固化剂和活性稀释剂,并研究其对体系性能的影响,确定了室温固化耐高温低黏度双酚F环氧树脂配方体系。该体系黏度低,凝胶时间较长,耐热性良好,力学性能优异。固化产物的T_g可达110℃以上,拉伸强度可达90 MPa,弯曲强度可达150 MPa。能够很好地适用于低温固化,中、高温使用的树脂基复合材料成型技术。


By selecting and optimizing the active diluents,the curing agent and the cure schedule,diglycidyl ether of bisphenol F(DGEBF)resin system cured at room temperature was studied.This system had low vis- cosity,long gel time,high heat-resistance and mechanical properties.When it was cured at 40~50℃,the T_g of castings could reach 110℃and the tensile and flexural strength were 90 MPa and 140 MPa respectively.

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ISSN:1002-7432
2007年第22卷第1期
研究论文

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