The low pressure plasma deposition process was examined by a finite element analysis method to obtain temperature distributions in the substrate and deposit as a function of the deposit time. The transient solidification process was modeled by assuming that the entire deposition period could be divided into a number of discrete time steps where each element underwent phase transition during each time step. The computed heat input and output rates obtained from the experimental data and the calculated temperature profile at the end of previous time step were imposed as initial boundary conditions for the temperature calculation at the beginning of each time step. In this way, the problem was reduced to a multiple, one dimensional conduction analysis involving the necessary thermal properties and the latent heat of fusion. The computed temperture profile for the case of a copper deposit on the nickel substrate was shown to be in reasonable agreement with the experimental data. Based on these results, a thermal analysis was made on a more complex multi-layered alloy system.