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高功率808 nm AlGaAs/GaAs基半导体激光器巴条的热耦合特征

高功率808 nm AlGaAs/GaAs基半导体激光器巴条的热耦合特征

ISSN:1001-9014
2015年第34卷第1期
红外及光电技术与应用
乔彦彬    陈燕宁    赵东艳    张海峰 QIAO Yan-Bin , CHEN Yan-Ning , ZHAO Dong-Yan , ZHANG Hai-Feng
乔彦彬:北京南瑞智芯微电子科技有限公司, 北京 100192
陈燕宁:北京南瑞智芯微电子科技有限公司, 北京 100192
赵东艳:北京南瑞智芯微电子科技有限公司, 北京 100192
张海峰:北京南瑞智芯微电子科技有限公司, 北京 100192
Beijing Nari Smart-Chip Microelectronics Technology Company, Ltd., Beijing,Beijing Nari Smart-Chip Microelectronics Technology Company, Ltd., Beijing,Beijing Nari Smart-Chip Microelectronics Technology Company, Ltd., Beijing,Beijing Nari Smart-Chip Microelectronics Technology Company, Ltd., Beijing

利用红外热成像技术和有限元方法在实验和理论上研究了高功率808 nm半导体激光器巴条热耦合特征,给出了稳态和瞬态热分析,呈现了详细的激光器巴条热耦合轮廓.发现器件稳态温升随工作电流呈对数增加,热耦合也随之增加且主要发生在芯片级.另外,作者利用热阻并联模型解释了芯片级热时间常数随工作电流减小的现象.

The thermal crosstalk characteristics in high-power 808 nm AlGaAs/GaAs laser diode bar were investigated experimentally and theoretically using infrared thermography and finite element method. We have performed the steady-state and transient analysis. A detailed profile of thermal crosstalk in laser diode bar was presented in this paper. The steady-state temperature rise has a logarithmical dependence on the total operation current, and the thermal crosstalk between emitters increases with the current density. Furthermore, the transient thermal analysis suggested that the thermal crosstalk occurred mainly in chip. Using thermal resistance parallel connection model, we explained the phenomena that the time constant of chip decreased with the increase of total operation current.

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ISSN:1001-9014
2015年第34卷第1期
红外及光电技术与应用

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