知识与财富的链接
为制备能满足使用要求的高硅铝合金电子封装材料,采用高能球磨对Al-Si合金粉末进行氧化预处理,结合包套热挤压制备Al2O3与SiO2增强的弥散强化型铝硅复合材料,并利用粉末粒度分析仪、氧分析仪、金相显微镜及扫描电镜对球磨粉末氧含量、粉末粒度及材料组织进行分析。研究结果表明:Al-Si合金粉末经24 h球磨后,粉末粒度明显减小,部分粒径从3～5μm减小到0.1～0.2μm;球磨后粉末形状从原来的长条状转变为细小的球状;粉末氧含量随着球磨时间延长而增加,且与球磨时间接近于呈线性关系;粉末经高能球磨后,所制备材料晶粒更加细小,特别是硅粒子已明显细化,材料组织更均匀、更致密;随着粉末球磨时间延长,材料热导率增加,球磨32 h后,材料热导率高达145.5 W·m-1·K-1。
In order to fabricate high-silicon aluminum alloys electronic packaging materials,the high-energy ball milling process was applied to the Al-Si alloy powder,combined with vacuum canning hot-extrusion process to fabricate SiO2 and Al2O3 dispersion strengthening composites.Powder particle size analyzer,oxygen content analyzer,optical microscope and scanning electron microscope were used to study the oxygen content and particle size of milled powders and fabricated material microstructure.The results show that when Al-Si alloy powder was milled after 24 h,the particle size decreases obviously and some from 3-5 μm to 0.1-0.2 μm.Particle shape varies from long strip to fine globosity after milling.Oxygen content increases and is linear with milling time.The crystal grain of material fabricated by milling powder is finer,especially Si particles minish obviously,and the microstructure is more uniform and compact.Thermal conductivity increases with the prolonging milling time,and after being milled for 32 h,it is 145.5 W.m-1.K-1.